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Weaving High Performance Multiprocessor Fabric

Architectural insights into the Intel® QuickPath Interconnect

By Robert A. Maddox, Gurbir Singh and Robert J. Safranek

SKU# 978-1-934053-18-8

Availability: In stock

Model Number: 978-1-934053-18-8
Publisher: Intel Press
Price: $79.95

Weaving High Performance Multiprocessor Fabric

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Weaving High Performance Multi-Processor Fabric introduces the Intel® QuickPath Interconnect, a high-speed, packetized, point-to-point system interconnect that uses multiple narrow high-speed links to stitch together processors into a fabric of a distributed shared memory-style platform architecture.

Compared with today’s wide Front Side Busses (FSB), the Intel QuickPath Interconnect offers higher bandwidth with coherency mechanisms that are optimized for low latency and high scalability. This book meets the needs of hardware design, validation and BIOS engineers in describing the compelling mix of performance and features in the Intel QuickPath Interconnect

 

Industry Talk

"This book is relevant to what I do every day as it provides the high-level knowledge required to effectively understand the details of the Intel QuickPath Interconnect architecture."

- Scott Diesing – Director of Engineering, Cray, Inc.

"Information like this is very useful as a precursor to starting a new circuit design. I find that members of my team tend to focus on the details of the circuits that they are designing and can miss the "big picture". This book certainly fills that gap and at a very readable level."

- Thomas Walley – Project Manager, Avago Technologies

Additional Information
Author(s) Gurbir Singh, Robert A. Maddox, Robert J. Safranek
ISBN 978-1-934053-18-8
Title Weaving High Performance Multiprocessor Fabric
Sub Title Architecural Insights to the Intel QuickPath Interconnect
Product Summary This book describes how the compelling mix of performance and features in the Intel QuickPath Interconnect provides the foundation for future generations of Intel microprocessors.
Quote

“With one day of reading this book, everyone familiar with the existing Front Side Bus architecture will have good visibility into what is new in the Intel QuickPath Interconnect.”

—Simon Czermak, Hardware Development Manager, Fujitsu Siemens

Publisher Intel Press
Page Count 305
Language English
Cover Soft
Available on Books 24 x 7 Yes
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